TU-722/TU-72P laminated board

       TU-722/TU-72P laminates/prepregs not only significantly enhance heat resistance, but also exhibit excellent UV protection properties, making them perfectly compatible with AOI (Automatic Optical Inspection) processes. These products are particularly suitable for circuit boards that require harsh thermal cycles or complex assembly work, demonstrating excellent adaptability. Its lower Z-axis thermal expansion characteristics effectively reduce potential issues such as solder pad lifting and cylinder cracking, significantly improving the stability and reliability of the circuit board.

        In addition, TU-722 laminates also exhibit excellent chemical resistance, ensuring stable performance in various chemical environments. For lead-free soldering assembly, it also demonstrates excellent thermal stability, meeting the high standards of modern circuit board manufacturing. Meanwhile, its general CAF (conductive anode wire) tolerance further enhances the long-term reliability of the circuit board. These outstanding characteristics make TU-722/TU-72P laminates/prepregs the preferred material in the field of circuit board manufacturing.

1.Electronic Manufacturing and Circuit Board Production
2.The automotive industry
3.Aerospace field