Ferlisflæði fyrir undirlag úr áli

1. Opnun

Framleiðsluferli undirlags áls

1. Ferlið við að klippa efni - klippa

2. Tilgangur opnunar

Skerið stórt- innkomandi efni í þá stærð sem þarf til framleiðslu

3. Varúðarráðstafanir við að opna efni

① Check the size of the first piece after cutting

② Pay attention to the scratches on the aluminum surface and the scratches on the copper surface

③ Pay attention to the layering and draping of the edge of the board

2. Borun

1. Borunarferli

Dúvel - Borun - skoðunarnefnd

2. Tilgangur borunar

Staðsetning og borun plötunnar til að aðstoða síðari framleiðsluferlið og samsetningu viðskiptavina

3. Varúðarráðstafanir við borun

① Check the number of drilled holes and the size of the holes

② Avoid scratches on the sheet

③ Check the drape of the aluminum surface and the deviation of the hole position

④ Check and replace the drill bit in time

⑤ Drilling is divided into two stages, one drilling: after cutting the material, the drilling is a peripheral tool hole

Önnur bor: verkfæragat í einingunni eftir lóðagrímu

3. Þurr/blaut kvikmyndamyndun

1. Þurr/blaut kvikmyndamyndunarferli

Malaplata - filmu - lýsing - þróun

2. Tilgangur þurr/blautrar kvikmyndatöku

Hlutarnir sem þarf til að búa til hringrásina eru sýndir á blaðinu

3. Varúðarráðstafanir fyrir þurra/blauta kvikmyndatöku

① Check whether there is an open circuit in the circuit after developing

② Whether there is any deviation in the development alignment to prevent the occurrence of dry film breakage

③ Pay attention to the defective circuit caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, keep it still for more than 15 minutes before developing

4. Sýra/basísk æting

1. Sýra/basískt ætingarferli

Etsing - stripping - þurrkun - skoðunarborðs

2. Tilgangur sýru/basískrar ætingar

Eftir að hafa myndað þurra/blauta filmuna skaltu halda nauðsynlegum hluta hringrásarinnar, fjarlægja umframhlutann utan hringrásarinnar og fylgjast með tæringu álundirlagsins með ætingarlausninni meðan á sýruætingu stendur;

3. Varúðarráðstafanir fyrir sýru/basískt ætingu

① Note that the etching is not clean and the etching is excessive

② Pay attention to line width and line thickness

③ The copper surface is not allowed to be oxidized or scratched

④ The dry film should be removed cleanly

Fimm, silkiskjár lóðmálmur, stafir

1. Silki skjár lóðmálmur gríma, eðli ferli

Silkiprentun - For-bakstur - Útsetning - Þróun - stafir

2. Tilgangur silki skjár lóðmálmur gríma og stafi

① Anti-soldering: protect the circuit that does not need to be soldered and prevent the tin from entering and causing a short circuit

② Characters: play the role of marking

3. Mál sem þarfnast athygli fyrir silkiskjár lóðmálmur og stafi

① To check whether there is garbage or foreign matter on the board

COB ál undirlag

COB ál undirlag

② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after screen printing to avoid bubbles in the lines

④ Pay attention to the thickness and uniformity of the silk screen

⑤ After pre-baking, the board should be completely cooled to avoid sticking to the film or destroying the gloss of the ink surface.

⑥ Place the ink face down during development

6. V-CUT, gong borð

1. V-CUT, gong borð ferli

V-CUT——Gong board——Tear off protective film——Remove Pifeng

2, V-CUT, tilgangur gongborðsins

① V-CUT: Connect a single PCS line to the whole PNL plate cutting and leave a small part for easy packaging and removal.

② gong board: remove the excess part of the circuit board

3. Varúðarráðstafanir fyrir V-CUT og gong borð

① During the V-CUT process, pay attention to the size of V, incomplete edges and burrs

② Pay attention to burrs when the gong board is used, and the gong knife is skewed. Check and replace the gong knife in time.

③ Finally, avoid scratches on the board when removing the front.

Sjö, próf, OSP

1. Próf, OSP ferli

Línupróf - Standast spennupróf - OSP

2. Próf, tilgangur OSP

① Line test: check whether the completed line is working normally

② Withstand voltage test: check whether the completed line can withstand the specified voltage environment

③ OSP: Make the circuit better for soldering

3, próf, OSP varúðarráðstafanir

① How to distinguish between qualified and unqualified products after testing

② Placement after finishing OSP

③ Avoid line damage

Átta, FQC, FQA, pökkun, sendingarkostnaður

1. Ferli

FQC - FQA - Pökkun - Sending

2. Tilgangur

① FQC conducts full inspection and confirmation of the product

② FQA random inspection and verification

③ Pack and ship to customers as required

3. Gefðu gaum

① FQC pays attention to the confirmation of appearance during the visual inspection process and makes a reasonable distinction

② FQA really conducts random inspections to verify the inspection standards of FQC

③ To confirm the number of packages, avoid mixed boards, wrong boards and package damage 3